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Materials and Process Section

Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This unrivaled reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect, and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this extremely popular ready reference contains up-to-the-minute information on plastics, elastomers and laminates; printed writing boards; ceramics and glasses; semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.