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Reliability/FEMA Section

Maintaining Electronic Systems (Design, installation & operation of electronic systems) (Hardcover)


List Price: $99.95
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During the past decade, electronic products have undergone immense changes. Most hardware contains tens or hundreds of integrated circuits, many of them surface-mounted devices. Those responsible for maintaining this equipment, however, are struggling to keep up with manufacturers of the gear. Technology has altered the way electronic products are designed and constructed. The service bench needs to change as well. Maintaining Electronic Systems examines the maintenance of electronic systems for criticaluse applications and is directed toward technician-level engineering personnel involved in the installation and maintenance of electronic equipment for industry. The book examines electronic systems used today in a wide variety of applications and explains how to identify and correct hardware failures.

This “must have” reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.



Failure Modes and Mechanisms in Electronic Packages (Hardcover)


List Price: $249.00 USD
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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects–their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.

This book includes an introduction to some important reliability concepts and a review of terminology. The work is divided into three sections: modelling, evaluation and assurance. Using a unique approach, the author examines both reliability physics and reliability statistics to reveal how they can be employed in order to discover why components fail and how failures develop over time. The text introduces several important reliability concepts and then divides into three key areas–modelling, evaluation and assurance.

The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of electronic and telecommunications component reliability. As a reference source, it summarizes the knowledge on failure modes, degradation and mechanisms, including a survey of accelerated testing, achieving better reliability, total quality topics, screening tests and prediction methods. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography round the benefit offered by the book. The technical level suites to senior and graduate students, as well as to experts and managers in industries.

Finally, a working tool that delivers expert guidance on all aspects of product reliability. W. Grant Ireson and Clyde F Coombs, Jr.’s new Second Edition of Handbook of Reliability Engineering and Management gives you the specific engineering, management, and mathematics data you need to design and manufacture more reliable electronic and mechanical devices as well as complete systems. You’ll find proven industry practices for defining and achieving reliability goals–real how-to information, not theoretical generalities. You also get new methods for determining overall product reliability. . .the latest design techniques for extending a product’s life cycle, tested strategies for incorporating reliability into new product development.

The definitive, all-in-one, cost-saving guide to electronic failure analysis–from the field’s top experts Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here in this complete, comprehensive source. You’ll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance.Absolutely essential to anyone concerned with electronic product development and testing, the Handbook gives you ready-to-use, insider information on state-of-the-art EFA

Design for Reliability (Electronics Handbook Series) (Hardcover)


List Price: $231.00 USD
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Today’s marketplace demands product reliability. At the same time, it places ever-increasing demands on products that push the limits of their performance and their functional life, and it does so with the expectation of lower per-unit product costs. To meet these demands, product design now requires a focused, streamlined, concurrent engineering process that will produce a product at the lowest possible cost in the least amount of time.Design for Reliability provides a systematic approach to the design process that is sharply focused on reliability and firmly based on the physics of failure. It imparts an understanding of how, why, and when to use the wide variety of reliability engineering tools available and offers fundamental insight into the total design cycle. Applicable from the idea phase of the product development cycle through product obsolescence,

Introduces the benefits and techniques of performing burn-in on components, sub-assemblies, and complete systems. An engineering approach, this text emphasizes practical applications of reliability theory. Presents numerous real-life examples. Provides the fundamental information needed to design and analyze a meaningful and effective burn-in procedure.

The problem of corrosion prevention is best solved prior to and during the Design stage. In order to make basic design decisions, it is necessary to understand the mechanism of corrosion.

Materials Engineering is a broad field involving not only the design and fabrication of materials, but also their efficient application in structural designs, product fabrication, and related industrial technologies. A crucial feature in materials fabrication involves an understanding of elemental chemistry and crystal structures, while applications normally hinge upon the relationship of those structures to properties and behavior of materials.

What Every Engineer Should Know about Reliability and Risk Analysis (Hardcover)


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Examining reliability, availability, and risk analysis and reviewing in probability and statistics essential to understanding reliability methods, this outstanding volume describes day-to-day techniques used by practicing engineers;discussing important reliability aspects of both components and complex systems.

More Hot Air (Paperback)


List Price: $46.00
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Everything You Know About Cooling Electronics Is Wrong. This new book continues in the same humorous and easy-to-read style of the earlier book, with all-new, original case studies in the field of electronics cooling. Each case study is designed to teach a basic concept of heat transfer, as applied to keeping electronics from overheating. The ob of cooling electronics continues to get tougher. Many people not trained in the basics of heat transfer have been roped into doing this job out of necessity. For those who lack any formal training in heat transfer, the case studies explode many of the myths about cooling electronics and replace these flawed practices with sound engineering, based on actual heat transfer theory.

Accelerated Reliability Engineering: HALT and HASS (Hardcover)


List Price: $140.00
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Accelerated Reliability Engineering Halt and Hass Gregg K. Hobbs Hobbs Engineering Corporation, Westminster, Colorado, USA Accelerated reliability engineering is becoming a popular industry alternative to on-going product quality testing. Highly Accelerated Life Tests (HALT) and Highly Accelerated Stress Screens (HASS) are intensive methods which use stresses higher than the field environments to expose and then improve design and process weaknesses. HALT and HASS offer faster, cheaper and more accurate results than traditional reliability testing techniques. This book provides comprehensive coverage of the methods and philosophy behind this successful approach.

Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong (Paperback)


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This popular book is a collection of myths, mistakes, and lessons learned from practicing engineers involved in the field of electronic equipment cooling. Through entertaining anecdotes and stories based on his experience at Tellabs Operations, Inc. Tony Kordyban covers basic dimensions of heat transfer concepts–mostly from real problems which were incorrectly solved at least once before a correct technique was applied. The book’s 31 chapters, each on an important and relevant topic, contain simple line drawings to help illustrate the basic concepts, while the text provides accurate and complete technical explanations. The book’s case study approach makes it an extremely useful and handy reference.

The Basics of FMEA (Paperback)


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Failure mode and effect analyses (FMEAs) can actually help prevent failures, defects, and errors, because FMEAs identify special causes of variation before they occur. This is why the automotive industry’s QS-9000 standard requires their use. But FMEAs are a valuable tool for any industry in which defect prevention is important. The Basics of FMEA: Explains failure mode and effect analysis simply and concisely. Discusses when to use FMEAs (e.g., during design, manufacturing, etc.). Shows how to perform FMEAs step-by-step. The book also discusses the QS-9000 requirement and is an ideal hands-on team resource, training supplement, and reference.

Thermal Measurements in Electronics Cooling (Hardcover)


List Price: $243.00 USD
New From: $149.47 USD In Stock
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Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic.This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples.

Manufacturers have been struggling for years with the necessity to produce high quality products that do not fail once they have been delivered to the customer. Auditing for stated reliability expectations can create a good product – but exceeding these standards will create a superior product. HALT (Highly Accelerated Life Test), HASS (Highly Accelerated Stress Screen), and HASA (Highly Accelerated Stress Audit) are intensive methods used by the world’s top manufacturers to expose products to extreme environmental conditions, improve design and process weaknesses, and improve product quality – all before the product is introduced to the market.

In recent years, much useful methodology has been developed in accelerated testing–this book makes it available to practitioners. Many products last so long that life testing at design conditions is impractical. However, these products can be life-tested at high-stress conditions to yield failures quickly. Such testing saves much time and money–and analyses of data from an accelerated test yield needed information on product life at design (low stress) conditions. Presents practical, modern, statistical methods for accelerated testing including test models, analyses of data and plans for testing. Each topic is self-contained for easy reference. Coverage is broad and detailed enough to serve as a text or reference. Contains many real test examples along with data analyses.

This classic text has now been completely revised and updated, making it an ideal introductory course in reliability for a wide range of engineering qualifications, including City & Guilds 8030 and HNC/Ds. A new chapter focuses on the role of the microprocessor and microcomputer controller, and the use of algorithms for monitoring system performance. The addition of numerous problems, selfcheck questions and exam-style questions makes this an extremely useful book for courses with an element of independent study.

Private Printings

Parts Selection, Application & Control
This was the first in a series of publications from RIAC dealing with reliable application of parts. It is an “overview” document addressing topics of a general nature affecting all types of parts, thus providing designers, reliability engineers and managers with the means to assure that electrical and electronic parts are selected, applied and controlled in a manner that is the most efficient and costeffective. It identifies specific selection, procurement methods and tools for properly applying electrical and electronic parts most suitable for the unique requirements of a given DoD or commercial application.

Electronic Derating for Optimum Performance
The RIAC offers extensive line of reliability, maintainability, quality, supportability, and interoperability. The purpose of this publication is to present electronic part stress derating parameters for twenty one part types. This publication includes an introduction to part stress derating theory, part derating definitions, part application guides, and part failure mode and mechanism frequency. The derating section includes application recommendations and specific electrical and environmental derating parameters. Two levels of stress derating are described, one for office type environments and one for uncontrolled conditions such as those found in an automobile or aircraft.

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